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Catalog Number:
31544
CAS Number:
585-48-8
2,6-Di- tert -butylpyridine
Purity:
≥ 99% (GC)
Hazmat
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Product Information

Incompatible avec les acides forts, les agents oxydants forts. Tenir à l'écart des sources d'ignition, de chaleur, d'étincelles, de flammes nues et des substances incompatibles. Éviter les périodes de stockage prolongées. Manipuler sous gaz inerte.

CAS Number
585-48-8
Purity
≥ 99% (GC)
Molecular Formula
C 13 H 21 N
Molecular Weight
191.32
MDL Number
MFCD00006306
PubChem ID
68510
Melting Point
2 °C
Density
0,852 g/mL à 25 °C
Appearance
Liquide incolore et clair
Boiling Point
100 - 101 °C (23 mmHg)
Refractive Index
1,472 - 1,475
Conditions
Conserver entre 2 et 8 °C
General Information
CAS Number
585-48-8
Purity
≥ 99% (GC)
Molecular Formula
C 13 H 21 N
Molecular Weight
191.32
MDL Number
MFCD00006306
PubChem ID
68510
Melting Point
2 °C
Density
0,852 g/mL à 25 °C
Appearance
Liquide incolore et clair
Boiling Point
100 - 101 °C (23 mmHg)
Refractive Index
1,472 - 1,475
Conditions
Conserver entre 2 et 8 °C
Properties
Additional property information coming soon!
-
Safety and Regulations
Hazmat
Oui
Antibiotic
Non
DEA-regulated
Non
Warnings
-
Applications

2,6-Di-tert-butylpyridine is widely utilized in research focused on:

  • Antioxidant Applications: This compound is effective in preventing oxidative damage in various materials, making it valuable in the production of plastics and rubber, where it enhances longevity and performance.
  • Catalysis: It serves as a ligand in catalytic processes, particularly in organic synthesis, improving reaction efficiency and selectivity in the pharmaceutical industry.
  • Corrosion Inhibition: Used in coatings and treatments, it helps protect metals from corrosion, which is crucial in industries like automotive and construction.
  • Pharmaceutical Development: Its properties are leveraged in drug formulation, particularly for stabilizing active ingredients and enhancing bioavailability.
  • Research in Material Science: The compound is studied for its role in developing new materials with enhanced thermal and chemical stability, beneficial in electronics and aerospace applications.

Citations