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Catalog Number:
04806
Résine AM 4-hydroxyméthylphénoxyacétyle
Synonym(s):
Résine HMPA AM
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$74.81 /5G
Taille
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Product Information

Cette résine AM est fonctionnalisée avec le linker HMPA. Cette résine est environ 30 fois plus stable que la résine HMPB.

Synonyms
Résine HMPA AM
Molecular Weight
0
MDL Number
MFCD00283444
Substitution
0,3-0,7 méq/g
Mesh Size
100-200 mailles
Conditions
Magasin chez RT
%DVB
1% DVB
General Information
Synonyms
Résine HMPA AM
Molecular Weight
0
MDL Number
MFCD00283444
Substitution
0,3-0,7 méq/g
Mesh Size
100-200 mailles
Conditions
Magasin chez RT
%DVB
1% DVB
Properties
Additional property information coming soon!
-
Safety and Regulations
Hazmat
Non
Antibiotic
Non
DEA-regulated
Non
Warnings
-
Applications

4-Hydroxymethylphenoxyacetyl AM resin is widely utilized in research focused on:

  • Adhesives and Sealants: This resin is commonly used in formulating high-performance adhesives that require strong bonding capabilities, making it ideal for construction and automotive industries.
  • Coatings: It serves as a key ingredient in protective coatings, providing durability and resistance to environmental factors, which is essential for maintaining the longevity of surfaces in industrial applications.
  • Composite Materials: The resin is employed in the production of composite materials, enhancing their mechanical properties. This is particularly beneficial in aerospace and automotive sectors where lightweight and strength are critical.
  • Pharmaceutical Applications: In the pharmaceutical industry, it is used in drug delivery systems, improving the bioavailability of active compounds and ensuring targeted release.
  • Research and Development: Researchers utilize this resin in various experimental setups, particularly in polymer science, to study its properties and potential applications in new materials.

Citations