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Catalog Number:
31544
CAS Number:
585-48-8
2,6-Di -tert -butilpiridina
Purity:
≥ 99% (GC)
Hazmat
Documents
$20.00 /1G
Tamaño
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Product Information

Incompatible con ácidos fuertes y oxidantes fuertes. Mantener alejado de fuentes de ignición, calor, chispas, llamas abiertas y sustancias incompatibles. Evitar periodos prolongados de almacenamiento. Manipular en atmósfera inerte.

CAS Number
585-48-8
Purity
≥ 99% (GC)
Molecular Formula
C13H21N
Molecular Weight
191.32
MDL Number
MFCD00006306
PubChem ID
68510
Melting Point
2 °C
Density
0,852 g/ml a 25 °C
Appearance
Líquido incoloro y transparente.
Boiling Point
100-101 °C (23 mmHg)
Refractive Index
1.472 - 1.475
Conditions
Conservar entre 2 y 8 °C.
General Information
CAS Number
585-48-8
Purity
≥ 99% (GC)
Molecular Formula
C13H21N
Molecular Weight
191.32
MDL Number
MFCD00006306
PubChem ID
68510
Melting Point
2 °C
Density
0,852 g/ml a 25 °C
Appearance
Líquido incoloro y transparente.
Boiling Point
100-101 °C (23 mmHg)
Refractive Index
1.472 - 1.475
Conditions
Conservar entre 2 y 8 °C.
Properties
Additional property information coming soon!
-
Safety and Regulations
Hazmat
Antibiotic
No
DEA-regulated
No
Warnings
-
Applications

2,6-Di-tert-butylpyridine is widely utilized in research focused on:

  • Antioxidant Applications: This compound is effective in preventing oxidative damage in various materials, making it valuable in the production of plastics and rubber, where it enhances longevity and performance.
  • Catalysis: It serves as a ligand in catalytic processes, particularly in organic synthesis, improving reaction efficiency and selectivity in the pharmaceutical industry.
  • Corrosion Inhibition: Used in coatings and treatments, it helps protect metals from corrosion, which is crucial in industries like automotive and construction.
  • Pharmaceutical Development: Its properties are leveraged in drug formulation, particularly for stabilizing active ingredients and enhancing bioavailability.
  • Research in Material Science: The compound is studied for its role in developing new materials with enhanced thermal and chemical stability, beneficial in electronics and aerospace applications.

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