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Catalog Number:
01813
CAS Number:
55844-94-5
Poliestireno clorometilado (0,8 - 1,4 meq/g, malla 200 - 400)
Synonym(s):
Resina Merrifield
Documents
$22.03 /5G
Tamaño
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Product Information

El poliestireno clorometilado y los monómeros de estireno se copolimerizan para obtener la resina Merrifield. Este método evita el uso de éter metil clorometilado cancerígeno. Esta resina se utiliza en la síntesis de ácidos peptídicos mediante la estrategia Boc y se puede escindir mediante HF o TFMSA. También se encuentran disponibles en stock diferentes aminoácidos protegidos con Boc unidos a esta resina. Por favor, consulte.

Synonyms
Resina Merrifield
CAS Number
55844-94-5
Molecular Weight
0.0
MDL Number
MFCD00146406
Appearance
Perlas de polímero de color entre pálido y amarillo y blanco.
Substitution
0,8 - 1,4 meq/g
Mesh Size
Malla 200 - 400
Conditions
Tienda en RT
%DVB
1% DVB
General Information
Synonyms
Resina Merrifield
CAS Number
55844-94-5
Molecular Weight
0.0
MDL Number
MFCD00146406
Appearance
Perlas de polímero de color entre pálido y amarillo y blanco.
Substitution
0,8 - 1,4 meq/g
Mesh Size
Malla 200 - 400
Conditions
Tienda en RT
%DVB
1% DVB
Properties
Additional property information coming soon!
-
Safety and Regulations
Hazmat
No
Antibiotic
No
DEA-regulated
No
Warnings
-
Applications

Chloromethylated polystyrene is widely utilized in research focused on:

  • Polymer Chemistry: This compound serves as a versatile building block for synthesizing various copolymers, enhancing material properties such as strength and flexibility.
  • Ion Exchange Resins: It is used to create ion exchange resins, which are crucial in water purification processes, enabling the removal of unwanted ions and improving water quality.
  • Drug Delivery Systems: Researchers employ chloromethylated polystyrene in the development of drug delivery systems, allowing for controlled release of medications, which can improve therapeutic outcomes.
  • Adhesives and Sealants: This chemical is incorporated into formulations for adhesives and sealants, providing superior bonding strength and resistance to environmental factors.
  • Surface Modification: It is applied in surface modification techniques to enhance the adhesion properties of various substrates, benefiting industries like electronics and automotive.

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